Capabilities
New Product Introduction
- BOM Analysis, Machine Programming Interface, and Process Documentation via Aegis NPI Software
- Business Management Systems utilizing Intuitive ERP
- Quick-Turn Prototype
- 3 to 5 day Process Time
- Dedicated NPI Cell
- Design Feedback Mechanism
top
SMT Technologies
- Multiple High Speed Production Lines
- Single and Double Sided Boards
- Single-layer rugged/heavy construction
- Multi-layer complex high density fine pitched components including BGA, uBGA, connectors and 0201placement
- Flex circuit technologies
- RoHS compliant manufacturing
top
Assembly Process Technologies
- Multiple board finishes including HASL, nickel-gold, and immersion tin
- PB Free, No Clean, RMA, and Water Soluble Chemistries
- Wave Solder w/Chip Wave
- Automated Thru-Hole Insertion; Radial, Axial, Dip
- Austin American Micro-Jet Aqueous Cleaning System
- Hand Assembly via Customized Work Cells and Progressive Flow Lines
- Electro-Mechanical Assembly with Dedicated Customer Product Cells
- Cable and Harness Interconnect from 8ga to 30ga Wire with Automated Laser and Mechanical Wire Stripping Terminations
- Selective Solder Automation Equipment
top
Test
- Development Services
- We can provide test station design to support manufacturing processes with in-circuit and functional testing.
- Flying Probe Test
- Four independent test probes simultaneously apply the stimuli and perform the measurements needed to fully test a printed circuit board. Active and passive analog tests, signature analysis on each test point, boundary scan, and component presence and orientation and inspection are performed. This test, similar to in-circuit without the use of a fixture, is ideal for low-volume high-mix production and for first-piece and prototyping to prove out a design. This method of testing saves our customers time and money by improving throughput for new product introductions and eliminating the need for costly replacement fixtures when assemblies are redesigned.
- Functional Test
- Functionality of the final product can be tested to our customer's specifications using customer-furnished test equipment or special test equipment and specifications developed by Saunders Electronics.
- X-Ray Imaging
- Quickly and automatically scans a printed circuit board assembly, analyzes the cross-sectional X-ray images and identifies the exact location and characteristics of solder joints, ensuring the quality of BGA placements and reducing costly and time consuming component removal and replacement.
top
